Description:
Victor Thenot
By leveraging recent advancements in printed electronics, the Tageos Innovation Center of Excellence is advancing the companies’ specialty RFID and BLE inlay portfolio through the integration of innovative materials and scalable manufacturing processes. Beyond enabling highly functional inlays and sensor tags, printed electronics also contributes to reducing the environmental footprint of electronic products through additive manufacturing, improved material efficiency, and the use of more sustainable substrates.
This presentation will highlight how printed electronics supports the design and industrialization of advanced paper-based products at Tageos. Concrete examples will include printed conductive interconnects and functional bridges, as well as the integration of thin, flexible printed batteries on paper.
The talk will further explore the role of emerging flexible printed semiconductor technologies – such as Pragmatic’s NFC FlexIC – in enabling fully paper-based electronic inlays.
Through these case studies, the speaker will demonstrate how material selection, device architecture, and process design must be carefully balanced to achieve optimal performance, scalability, and sustainability. By combining additive manufacturing, alternative conductive inks, innovative substrates, and flexible chip technologies, printed electronics emerges as a key enabler for next-generation paper-based RFID and NFC products with a reduced carbon footprint.
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